Title :
Concurrent packaging architecture design
Author :
Cao, L.P. ; Krusius, J.P.
Author_Institution :
Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
Abstract :
Packaging is one of the primary constraints on the performance and partitioning of high density electronic systems. A concurrent design methodology for the design of the physical structure of such systems is presented here. Architecture, electrical, performance and energy management aspects are included. The CAD tool AUDiT implements this design methodology. The concurrent design capability has been illustrated using a model system derived from the high speed Digital Equipment 3000/500 (Alpha) engineering workstation
Keywords :
CAD; concurrent engineering; design engineering; engineering workstations; packaging; AUDiT; CAD tool; concurrent design methodology; electrical performance; energy management; high density electronic systems; high speed Digital Equipment 3000/500 (Alpha) engineering workstation; model system; packaging architecture; partitioning; Computational modeling; Design automation; Design methodology; Electronics packaging; Energy management; Frequency; Integrated circuit interconnections; Partitioning algorithms; Power system modeling; Workstations;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367648
