EDQUAD-an enhanced performance plastic package

EDQUAD represents a new family of packages designed for applications that require enhanced thermal and electrical performance not provided by the standard plastic packages. It includes standard Metric QFP, 1.4 mm thick TQFP and PLCC packages ranging from 7 mm-40 mm bodies and leadcounts in the 20-304 range. The packages are designed with an integral heatspreader exposed to air, used as a ground plane as well. The die is attached directly to the heatspreader to minimize the thermal resistance. The power and ground pads of the die can be wire bonded directly on separate internal rings to minimize the inductance. Measurements on a 28×28 mm, 208 lead EDQUAD show that the power dissipation is doubled to over 4 Watt/chip compared to an equivalent plastic QFP and, with an external heatsink attached, the package can dissipate up to 10 Watt/chip for most applications. The lead impedance can be controlled to 50 Ohm and the inductance of ground/power connections is significantly reduced. The package reliability meets the commonly accepted standards