A high performance HDI based pin grid array package

The High Density Interconnection (HDI) multichip packaging technology was used to fabricate a prototype high performance single chip package designed to be pin compatible with package used for the Alpha AXP 21064 microprocessor chip. The HDI technology was used to create a planar land grid array with chip connections dispersed to lands at the appropriate grid points. A silicon based bypass capacitance chip was included in the HDI package for reference system bypass capacitance. The pin grid array (PGA) interface was provided by the solder attachment of a simple ceramic pin field unit. Packages were successfully assembled and electrically tested. The merits of such an assembled package are discussed along with potential variations for improved cost performance