1994 Proceedings. 44th Electronic Components and Technology Conference

fYear

1994

fDate

1-4 May 1994

Abstract

The following topics were dealt with: flip-chip/BGA packaging; enhanced packaging; modelling and simulation; encapsulants and moulding compounds; reliability of plastic packages; devices, technologies and applications; process advances; systems and modules; optoelectronic devices; metallisation and PCB processes; thermal simulation and electronic package characterisation; interconnection reliability assessment; leadframe packaging advances; PCBs for HF applications; die attach, adhesive and solder materials; ceramics and thick films; optoelectronic materials; multichip modules; electronic connector technology; gold-based interconnection systems; optical fibres and connectors; reliability test methods; hand soldering

Keywords

electric connectors; encapsulation; flip-chip devices; metallisation; modelling; modules; optical couplers; optoelectronic devices; packaging; printed circuits; reliability; simulation; soldering; testing; BGA packaging; MCM; PCB processes; adhesive materials; ceramics; die attach materials; electronic connector technology; electronic package characterisation; encapsulants; flip-chip; leadframe packaging; metallisation; modelling; moulding compounds; multichip modules; optical connectors; optical fibres; optoelectronic devices; optoelectronic materials; plastic packages; reliability test methods; simulation; solder materials; soldering; thermal simulation; thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC, USA

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367661

Filename

367661