Title :
Probing phase segregation in porphyrin-polymer blends with multidimensional ir spectroscopy
Author :
Eigner, Audrey A. ; Massari, Aaron M.
Author_Institution :
Dept. of Chem., Univ. of Minnesota, Minneapolis, MN, USA
Abstract :
Multidimensional IR spectroscopy is used to study blends of the regioregular semiconducting polymer, poly(3-hexylthiophene) with ruthenium porphyrins in solid state thin films. A ruthenium-bound carbon monoxide ligand is a sensitive reporter of the local electrostatic environment and indicates that the porphyrins localize into phase-segregated domains upon annealing in solvent vapor. The FTIR spectrum of this ligand reports on the state of aggregation, which we then correlate with transmission electron microscopy images of these films before and after annealing. We then use 2D-IR spectroscopy, an ultrafast IR technique, to measure the fast structural dynamics that are present in the vicinity of the CO ligand when it is homogeneously blended in the polymer film and phase segregated into purely porphyrinic domains.
Keywords :
Fourier transform spectra; aggregation; annealing; infrared spectra; organic semiconductors; phase separation; polymer blends; polymer films; segregation; transmission electron microscopy; 2D IR spectroscopy; FTIR spectrum; fast structural dynamics; local electrostatic environment reporter; multidimensional IR spectroscopy; octaethyl-ruthenium-porphyrin carbonyl; phase segregated domains; phase segregation; poly-3-hexylthiophene; porphyrin localisation; porphyrin-polymer blends; regioregular semiconducting polymer blends; ruthenium bound carbon monoxide ligand; ruthenium porphyrins; solid state thin films; solvent vapor annealing; transmission electron microscopy; ultrafast IR technique; Biocompatible Materials; Complex Mixtures; Materials Testing; Organoselenium Compounds; Phase Transition; Porphyrins; Spectroscopy, Fourier Transform Infrared;
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2009.5332786