Title :
Passivation and Nucleation of Ge(100) via H2O and HOOH Dosing
Author :
Kaufman-Osborn, Tobin ; Lee, Joon Sung ; Kiantaj, K. ; Kummel, Andrew C.
Author_Institution :
Mater. Sci. & Eng., Univ. of California, San Diego, CA, USA
Abstract :
Germanium is a promising candidate for potential channel materials due to its higher hole and electron mobility. To minimize the oxide-semiconductor interfacial defect density, a proper passivation layer must be used before the oxide layer is deposited1. The passivation layer must be very thin, ideally one monolayer, to allow for increased scaling of the equivalent oxide thickness (EOT). H2O provides a well-ordered chemisorption monolayer (ML) at room temperature without disrupting surface Ge atoms2. In this study, a monolayer of H2O chemisorbates is shown to activate TMA chemisorption due to the Ge-OH bonds catalyzing the formation of an ultrathin passivation layer which can serve as an ideal ALD nucleation template on a Ge surface3. However, since H2O chemisorption results in equal density of Ge-H and Ge-OH sites on the Ge(100), H2O can only provide a maximum of 0.5 monolayer of Ge-OH sites, limiting the TMA nucleation density. By using HOOH dosing, the density of Ge-OH sites can be doubled thereby increasing the potential TMA nucleation density. This study compares the passivation of the Ge(100) surface via H2O and HOOH, for the application of nucleating ALD growth on the surface, using scanning tunneling microscopy (STM) and scanning tunneling spectroscopy (STS). This study will also look into similar H2O/HOOH passivation and TMA nucleation techniques on SiGe.
Keywords :
Ge-Si alloys; chemisorbed layers; chemisorption; electron mobility; hole mobility; interface states; monolayers; nucleation; oxidation; passivation; scanning tunnelling microscopy; scanning tunnelling spectroscopy; ALD nucleation template; EOT; Ge; STM; STS; SiGe; TMA chemisorption; TMA nucleation density; channel material; chemisorbates; chemisorption monolayer; electron mobility; equivalent oxide thickness; hole mobility; nucleating ALD growth; oxide layer; oxide-semiconductor interfacial defect density; scanning tunneling microscopy; scanning tunneling spectroscopy; temperature 293 K to 298 K; ultrathin passivation layer; Annealing; Passivation; Pollution measurement; Surface cleaning; Surface contamination; Thermal stability; Water;
Conference_Titel :
Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
Conference_Location :
Berkeley, CA
Print_ISBN :
978-1-4577-1864-9
Electronic_ISBN :
978-1-4577-1863-2
DOI :
10.1109/ISTDM.2012.6222496