DocumentCode :
2385701
Title :
On-chip RF isolation techniques
Author :
Blalack, Tallis ; Leclercq, Youri ; Yue, Patrick C.
Author_Institution :
Cadence Design Syst. Inc., San Jose, CA, USA
fYear :
2002
fDate :
2002
Firstpage :
205
Lastpage :
211
Abstract :
On-chip isolation is a function of many interdependent variables. This paper uses industry examples to highlight the isolation impacts of technology - substrate doping levels and triple wells, grounding/guard rings, shielding, capacitive decoupling, and package inductance.
Keywords :
capacitance; chip scale packaging; earthing; inductance; integrated circuit manufacture; isolation technology; microwave integrated circuits; microwave isolators; reviews; semiconductor doping; shielding; capacitive decoupling; grounding; guard rings; industry examples; interdependent variables; on-chip RF isolation techniques; package inductance; review; shielding; substrate doping levels; triple wells; BiCMOS integrated circuits; CMOS process; Conductivity; Doping; Grounding; Impedance; Inductance; Isolation technology; Packaging; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 2002. Proceedings of the 2002
ISSN :
1088-9299
Print_ISBN :
0-7803-7561-0
Type :
conf
DOI :
10.1109/BIPOL.2002.1042919
Filename :
1042919
Link To Document :
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