Title :
On-chip RF isolation techniques
Author :
Blalack, Tallis ; Leclercq, Youri ; Yue, Patrick C.
Author_Institution :
Cadence Design Syst. Inc., San Jose, CA, USA
Abstract :
On-chip isolation is a function of many interdependent variables. This paper uses industry examples to highlight the isolation impacts of technology - substrate doping levels and triple wells, grounding/guard rings, shielding, capacitive decoupling, and package inductance.
Keywords :
capacitance; chip scale packaging; earthing; inductance; integrated circuit manufacture; isolation technology; microwave integrated circuits; microwave isolators; reviews; semiconductor doping; shielding; capacitive decoupling; grounding; guard rings; industry examples; interdependent variables; on-chip RF isolation techniques; package inductance; review; shielding; substrate doping levels; triple wells; BiCMOS integrated circuits; CMOS process; Conductivity; Doping; Grounding; Impedance; Inductance; Isolation technology; Packaging; Radio frequency;
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 2002. Proceedings of the 2002
Print_ISBN :
0-7803-7561-0
DOI :
10.1109/BIPOL.2002.1042919
