DocumentCode :
2386995
Title :
How do material and information flows impact fab performance?
Author :
Scott, Douglas
Author_Institution :
PRI Autom., Billerica, MA, USA
fYear :
2000
fDate :
2000
Firstpage :
233
Lastpage :
236
Abstract :
Historically, a lot of attention has been given to improving the physics, the chemistry and the process technologies used in semiconductor manufacturing. This focus has produced dramatic results. Since its inception, the semiconductor industry has achieved productivity improvements unmatched by any other industry. Shrinking feature sizes, larger wafers, yield improvements and other productivity gains have contributed to this success. However, most of the known technological capabilities will be approaching or have reached their limits within 10-15 years. Already, larger wafers and improved yields are making a smaller contribution to productivity improvements than they have in the past, creating a widening gap in the productivity curve. This paper discusses how automated material and information flow can help close this gap in the productivity curve, and results that have been achieved
Keywords :
integrated circuit manufacture; process control; production control; automated material-information flow; feature size; productivity gains; productivity improvements; semiconductor industry; semiconductor manufacturing; wafer size; yield improvements; Chemistry; Logistics; Manufacturing automation; Manufacturing industries; Manufacturing processes; Physics; Production facilities; Productivity; Semiconductor device manufacture; Semiconductor materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
0-7803-7392-8
Type :
conf
DOI :
10.1109/ISSM.2000.993656
Filename :
993656
Link To Document :
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