DocumentCode :
2390061
Title :
Automatic wire bonder designed for MEMS packaging
Author :
Liu, Yanjie ; Liu, Yuetao ; Sun, Lining
Author_Institution :
Robot. Inst., Harbin Inst. of Technol., Harbin
fYear :
2008
fDate :
9-11 April 2008
Firstpage :
21
Lastpage :
23
Abstract :
This paper introduces zoom microscope into the microscope positioning system to settle the contradiction between microscopepsilas visual range and depth of field. In the whole bonding application, bond targetspsila identification and orientation are the most important aspects for full-automation. Multiple scale images go through various image processing programs, and finally different bond targets are identified and positioned This measure is called ldquoglobal-coarse and local-precise orientationrdquo, with which full-automation bonding is realized. A zoom microscope based micro-positioning system was used to capture the multiple magnification images. The requirement for real-time auto-focusing for zoom microscope is proposed based on the analysis of zoom microscope model.
Keywords :
integrated circuit packaging; micromechanical devices; MEMS packaging; automatic wire bonder; bond targets identification; bonding application; full-automation; global-coarse orientation; image processing programs; local-precise orientation; microscope positioning system; microscope visual range; real-time auto-focusing; zoom microscope; Bonding; Equations; Focusing; Lenses; Machine vision; Micromechanical devices; Microscopy; Optical imaging; Packaging; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Conference_Location :
Nice
Print_ISBN :
978-2-35500-006-5
Type :
conf
DOI :
10.1109/DTIP.2008.4752944
Filename :
4752944
Link To Document :
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