DocumentCode :
2390453
Title :
On the nature of ultra-thin gate oxide degradation during pulse stressing of nMOSCAPs
Author :
Knowlton, William B. ; Kumar, Santosh ; Caldwell, Theodora ; Gomez, Jose J. ; Cheek, Betsy
Author_Institution :
Dept. of Electr. & Comput. Eng., Boise State Univ., ID, USA
fYear :
2001
fDate :
2001
Firstpage :
87
Lastpage :
88
Abstract :
Preliminary Pulse (dynamic) stress testing (PVS) results performed in accumulation indicate that degradation and breakdown mechanisms occur such as stress induced leakage current (SILC) and hard breakdown (HBD) as previously reported. Additional degradation and breakdown mechanisms due to PVS were observed for the first time such as soft breakdown (SBD), limited hard breakdown (LHBD) and moderate breakdown (MBD). Finally, post-PVS induced LHBD I-V measurements show the leakage current in accumulation is more than 5 orders of magnitude greater than in inversion at similar voltages
Keywords :
MOS capacitors; leakage currents; semiconductor device breakdown; I-V characteristics; hard breakdown; limited hard breakdown; moderate breakdown; nMOSCAP; pulse voltage stress; soft breakdown; stress induced leakage current; ultra-thin gate oxide degradation; Breakdown voltage; Capacitors; Current measurement; Degradation; Electric breakdown; Leakage current; Performance evaluation; Random access memory; Semiconductor device breakdown; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2001. 2001 IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-7167-4
Type :
conf
DOI :
10.1109/.2001.993924
Filename :
993924
Link To Document :
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