Fast and accurate isothermal measurements on process-split wafers

The tremendous push for high performance integrated circuits requires short process development cycle. Rapid reliability assessments on interconnect process technology is becoming increasingly indispensable. WLR isothermal test is a fast and effective tool to monitor process-induced defects in VLSI Cu interconnects. It shows good correlation with standard package electromigration tests. A new methodology is introduced to improve the accuracy and testing time of isothermal testings on multi-process splits