DocumentCode
2390486
Title
The influence of temperature gradients in isothermal electromigration tests
Author
Leong, Andrew Yap Kin ; Turner, Timothy E.
Author_Institution
Chartered Semiconductor
fYear
2001
fDate
15-18 Oct. 2001
Firstpage
91
Lastpage
93
Abstract
Temperature gradients exist at the ends of metal lines subjected to highly accelerated electromigration tests (e.g. Isothermal Test). These temperature gradients introduce a flux divergence that will impact the time to failure of a metal line. The impacts of such gradients are not modeled in Black´s equation. Thus the failure to consider these effects will lead to incorrect analysis of highly accelerated test results. This paper will show data which clearly illustrates the impact of temperature gradients during the Isothermal test
Keywords
Electrical resistance measurement; Electromigration; Equations; Failure analysis; Isothermal processes; Life estimation; Metals industry; Stress measurement; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2001. 2001 IEEE International
Conference_Location
Lake Tahoe, CA, USA
Print_ISBN
0-7803-7167-4
Type
conf
DOI
10.1109/IRWS.2001.993926
Filename
993926
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