DocumentCode

2390511

Title

Electromigration discussion group summary

Author

Schafft, Harry A.

Author_Institution

NIST

fYear

2001

fDate

2001

Firstpage

97

Lastpage

97

Keywords

Circuit testing; Copper; Electromigration; Extrapolation; Failure analysis; Guidelines; Integrated circuit interconnections; Maintenance; NIST; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Reliability Workshop Final Report, 2001. 2001 IEEE International

Print_ISBN

0-7803-7167-4

Type

conf

DOI

10.1109/IRWS.2001.993928

Filename

993928