Title :
Electromigration discussion group summary
Author :
Schafft, Harry A.
Author_Institution :
NIST
Keywords :
Circuit testing; Copper; Electromigration; Extrapolation; Failure analysis; Guidelines; Integrated circuit interconnections; Maintenance; NIST; Stress;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2001. 2001 IEEE International
Print_ISBN :
0-7803-7167-4
DOI :
10.1109/IRWS.2001.993928
