• DocumentCode
    2390816
  • Title

    New high fill-factor triangular micro-lens array fabrication method using UV proximity printing

  • Author

    Lin, Tang-Huang ; Yang, H. ; Chao, C.-K.

  • Author_Institution
    Dept. of Mech. Eng., Nat. Taiwan Univ. of Sci. & Technol., Taipei
  • fYear
    2008
  • fDate
    9-11 April 2008
  • Firstpage
    187
  • Lastpage
    191
  • Abstract
    A simple and effective method to fabricate a high fill-factor triangular microlens array using the proximity printing in lithography process is reported. The technology utilizes the UV proximity printing by controlling a printing gap between the mask and substrate. The designed approximate triangle microlens array pattern can be fabricated the high fill-factor triangular microlens array in photoresist. It is due to the UV light diffraction to deflect away from the aperture edges and produce a certain exposure in photoresist material outside the aperture edges. This method can precisely control the geometric profile of high fill factor triangular microlens array. The experimental results showed that the triangular micro-lens array in photoresist could be formed automatically when the printing gap ranged from 240 mum to 840 mum. The gapless triangular microlens array will be used to increases of luminance for backlight module of liquid crystal displays.
  • Keywords
    microlenses; optical arrays; optical fabrication; photoresists; proximity effect (lithography); ultraviolet lithography; UV light diffraction; UV proximity printing; aperture edges; backlight module; high fill-factor triangular microlens array; liquid crystal displays; luminance; photoresist; printing gap; Apertures; Automatic control; Diffraction; Fabrication; Lenses; Liquid crystal displays; Lithography; Microoptics; Printing; Resists;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
  • Conference_Location
    Nice
  • Print_ISBN
    978-2-35500-006-5
  • Type

    conf

  • DOI
    10.1109/DTIP.2008.4752981
  • Filename
    4752981