DocumentCode :
2391067
Title :
An optimal implementation of a superscalar architecture
Author :
Andrews, D.L.
Author_Institution :
Dept. of Electr. Eng., Arkansas Univ., Fayetteville, AR, USA
fYear :
1995
fDate :
21-24 May 1995
Firstpage :
499
Lastpage :
504
Abstract :
This paper describes an ongoing research effort at the High Density Electronics Center (HiDEC) and the University of Arkansas for developing optimal system designs based on Multichip Module (MCM) technology. This research effort is focused on developing a high performance superscalar processor architecture designed for use in an MIMD parallel architecture. The architectural tradeoffs performed for developing the superscalar architecture are discussed, including the partitioning of functionality in order to take advantage of the high density, high bandwidth I/O capabilities of MCMs. Results of an analysis study are also presented, showing the performance increase of the optimal MCM based design compared to a traditionally packaged RISC architecture
Keywords :
multichip modules; parallel architectures; pipeline processing; MCM technology; MIMD parallel architecture; high bandwidth I/O capabilities; high density; multichip module; optimal MCM based design; optimal implementation; superscalar architecture; Bandwidth; Circuit testing; Integrated circuit interconnections; Multichip modules; Packaging; Parallel architectures; Parallel machines; Performance analysis; Reduced instruction set computing; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
Type :
conf
DOI :
10.1109/ECTC.1995.515327
Filename :
515327
Link To Document :
بازگشت