High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors

Author

Temple, D. ; Bower, C.A. ; Malta, D. ; Robinson, J.E. ; Coffinan, P.R. ; Skokan, M.R. ; Welch, T.B.

Author_Institution

RTI Int., Research Triangle Park, NC

fYear

2006

fDate

11-13 Dec. 2006

Firstpage

1

Lastpage

4

Abstract

The paper describes a platform technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator devices hybridized with Si electronics. Among these applications are high performance infrared focal plane array detectors

Keywords

focal planes; integrated circuit technology; parallel processing; readout electronics; silicon; advanced infrared focal plane array sensors; high density 3D integration technology; high performance infrared focal plane array detectors; massively parallel signal processing; on-chip signal processing capabilities; platform technology; silicon integrated circuits; Array signal processing; Infrared detectors; Infrared sensors; Integrated circuit interconnections; Integrated circuit technology; LAN interconnection; Paper technology; Sensor arrays; Silicon; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 2006. IEDM '06. International

Conference_Location

San Francisco, CA

Print_ISBN

1-4244-0439-8

Electronic_ISBN

1-4244-0439-8

Type

conf

DOI

10.1109/IEDM.2006.346980

Filename

4154415