DocumentCode
2391258
Title
ARPA analog optoelectronic module program: packaging challenges for analog optoelectronic arrays
Author
Hsu, H.P. ; Yap, D. ; Ng, W. ; Yen, H.W. ; Armiento, C. ; Tabasky, M. ; Mehr, J. ; Negri, A. ; Haugsjaa, P.
Author_Institution
Hughes Res. Labs., Malibu, CA, USA
fYear
1995
fDate
21-24 May 1995
Firstpage
565
Lastpage
569
Abstract
This paper describes the packaging challenges associated with array-based transmitters and receivers used for analog fiber-optic links. The optoelectronic modules are being developed under an ARPA Analog Optoelectronic Module TRP. The paper will focus on the development of optoelectronic array modules using silicon waferboard technology for application to personal communication systems
Keywords
arrays; integrated optoelectronics; modules; optical communication equipment; optical fibre communication; packaging; ARPA Analog Optoelectronic Module TRP; analog fiber-optic links; optoelectronic array modules; packaging; personal communication systems; receivers; silicon waferboard technology; transmitters; Costs; Laboratories; Optical arrays; Optical fiber communication; Optical fibers; Optical receivers; Optical sensors; Optical transmitters; Packaging; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-2736-5
Type
conf
DOI
10.1109/ECTC.1995.515339
Filename
515339
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