DocumentCode
2391319
Title
Large area roller embossing of multilayered ceramic green composites
Author
Shan, Xuechuan ; Soh, Y.C. ; Shi, C.W.P. ; Tay, C.K. ; Lu, C.W.
Author_Institution
Singapore Inst. of Manuf. Technol., Singapore
fYear
2008
fDate
9-11 April 2008
Firstpage
314
Lastpage
319
Abstract
This paper presents our latest achievements in developing large area patterning of multilayered ceramic green composites using micro roller embossing. The aim of this research is to develop large area pattern technique for ceramic green substrates using a modified roller laminator, which is compatible with screen printing apparatus, for integration of micro embossing and printing in the future stage. A thin film nickel mold was developed via photolithography, nickel electroplating and photoresist strip-off. The mold had an effective panel size of 150 mmtimes 150 mm with the height of protrusive micro patterns being about 40 mum. Formation of micro patterns was successfully demonstrated over the whole panel area using roller embossing on laminated ceramic green tapes (HL2000 from Heraeus). Micro patterns for inductors, capacitors as well as interconnection with 50 mum line width were embossed on ceramic green substrates. With the optimized process parameters (including feeding speed, roller temperature and applied pressure), we have demonstrated that micro roller embossing is a promising method for large area patterning of ceramic green substrates.
Keywords
ceramics; composite materials; electroplating; embossing; interconnections; multilayers; photolithography; photoresists; Ni; capacitors; ceramic green substrates; inductors; interconnection; microroller embossing; modified roller laminator; multilayered ceramic green composites; nickel electroplating; optimized process parameters; photolithography; photoresist strip-off; protrusive micropatterns; roller temperature; screen printing apparatus; thin film nickel mold; Capacitors; Ceramics; Embossing; Inductors; Lithography; Nickel; Printing; Resists; Substrates; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Conference_Location
Nice
Print_ISBN
978-2-35500-006-5
Type
conf
DOI
10.1109/DTIP.2008.4753009
Filename
4753009
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