DocumentCode :
2391397
Title :
Power reduction technique using multi-Vt libraries
Author :
Srivastav, Meeta ; Rao, S.S.S.P. ; Bhatnagar, Himanshu
Author_Institution :
Dept. of EE, IIT Bombay, India
fYear :
2005
fDate :
20-24 July 2005
Firstpage :
363
Lastpage :
367
Abstract :
In DSM technology leakage power dissipation in a cell becomes significant. Due to this significant rise in leakage power some measures should be taken quite early in the design flow to reduce it rather than realizing it later and either increasing the time to market by increasing the number of iterations or increasing the cost of production by using costly packaging. We have explored various ways of reducing leakage power in the design and recommended one, the multi-Vt approach. We have carried out analysis using multi-Vt approach over a test design on 130nm and 90nm technology. We have also highlighted on ways of how and where to apply this approach effectively in a typical ASIC design flow. We compare our results with all other approaches and demonstrate an average reduction in leakage power by almost 4.9 times compared to normal approaches without paying any penalty for speed or even area.
Keywords :
application specific integrated circuits; integrated circuit design; 130 nm; 90 nm; ASIC design flow; deep submicron technology; leakage power dissipation; multi-Vt approach; multi-Vt libraries; power reduction technique; Costs; Fluid flow measurement; Libraries; Packaging; Power dissipation; Power measurement; Production; Testing; Time measurement; Time to market; ASIC; DFT; DSM; High-Vt; Leakage power; Low-Vt;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
System-on-Chip for Real-Time Applications, 2005. Proceedings. Fifth International Workshop on
Print_ISBN :
0-7695-2403-6
Type :
conf
DOI :
10.1109/IWSOC.2005.92
Filename :
1530972
Link To Document :
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