• DocumentCode
    2391397
  • Title

    Power reduction technique using multi-Vt libraries

  • Author

    Srivastav, Meeta ; Rao, S.S.S.P. ; Bhatnagar, Himanshu

  • Author_Institution
    Dept. of EE, IIT Bombay, India
  • fYear
    2005
  • fDate
    20-24 July 2005
  • Firstpage
    363
  • Lastpage
    367
  • Abstract
    In DSM technology leakage power dissipation in a cell becomes significant. Due to this significant rise in leakage power some measures should be taken quite early in the design flow to reduce it rather than realizing it later and either increasing the time to market by increasing the number of iterations or increasing the cost of production by using costly packaging. We have explored various ways of reducing leakage power in the design and recommended one, the multi-Vt approach. We have carried out analysis using multi-Vt approach over a test design on 130nm and 90nm technology. We have also highlighted on ways of how and where to apply this approach effectively in a typical ASIC design flow. We compare our results with all other approaches and demonstrate an average reduction in leakage power by almost 4.9 times compared to normal approaches without paying any penalty for speed or even area.
  • Keywords
    application specific integrated circuits; integrated circuit design; 130 nm; 90 nm; ASIC design flow; deep submicron technology; leakage power dissipation; multi-Vt approach; multi-Vt libraries; power reduction technique; Costs; Fluid flow measurement; Libraries; Packaging; Power dissipation; Power measurement; Production; Testing; Time measurement; Time to market; ASIC; DFT; DSM; High-Vt; Leakage power; Low-Vt;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System-on-Chip for Real-Time Applications, 2005. Proceedings. Fifth International Workshop on
  • Print_ISBN
    0-7695-2403-6
  • Type

    conf

  • DOI
    10.1109/IWSOC.2005.92
  • Filename
    1530972