• DocumentCode
    2391548
  • Title

    Electrostatically driven microgripper integrated piezoresistive force sensor

  • Author

    Chen, Tao ; Chen, Liguo ; Sun, Lining ; Li, Xinxin

  • Author_Institution
    State Key Lab. of Robot. & Syst., Robot. Inst., Harbin
  • fYear
    2008
  • fDate
    9-11 April 2008
  • Firstpage
    376
  • Lastpage
    380
  • Abstract
    This paper presents the design, fabrication, and application of an electrostatically driven microgripper integrated piezoresistive force sensor. The microgripper is designed to manipulate two microobjects at the same time with force sensing ability. Surface and bulk micromachining technology is employed to fabricate the microgripper from single crystal silicon wafer. The end effector of the gripper is a four arms structure, two fixed cantilever beams integrated with piezoresistive sensor are designed to sensing the gripping force, and an electrostatically driven microactuator is designed to provide the force to operate the other two movable arms. In this way, the four fingers structure enables the gripper to grasp two samples with different sizes at the same time. Experimental results show that it can successfully provide force sensing and play a main role in preventing damage of microparts in micromanipulation and microassembly tasks.
  • Keywords
    cantilevers; electrostatic actuators; elemental semiconductors; end effectors; force sensors; grippers; microassembling; micromachining; micromanipulators; piezoelectric devices; silicon; Si; bulk micromachining technology; electrostatically driven microgripper; end effector; fabrication technology; fingers structure; fixed cantilever beams; force sensing ability; integrated piezoresistive force sensor; microactuator; microassembly tasks; micromanipulation tasks; microobject manipulation; micropart damage prevention; single crystal silicon wafer; surface micromachining technology; Arm; End effectors; Fabrication; Force sensors; Grippers; Microactuators; Micromachining; Piezoresistance; Silicon; Structural beams;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
  • Conference_Location
    Nice
  • Print_ISBN
    978-2-35500-006-5
  • Type

    conf

  • DOI
    10.1109/DTIP.2008.4753023
  • Filename
    4753023