DocumentCode
2392492
Title
Floorplanning challenges in early chip planning
Author
Shin, Jeonghee ; Darringer, John A. ; Luo, Guojie ; Aharoni, Merav ; Lvov, Alexey Y. ; Nam, Gi-Joon ; Healy, Michael B.
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2011
fDate
26-28 Sept. 2011
Firstpage
388
Lastpage
393
Abstract
Early chip planning is becoming more critical as server system designers strive to explore a large design space with multiple cores and accelerators in an advanced silicon technology that includes 3D chip stacking. During early chip planning, designers search for the high-level design and layout that best satisfies a myriad of constraints and targets. In this paper, we discuss our experience in applying traditional floorplanning tools at this early stage and suggest how they might be adapted for early floorplanning.
Keywords
integrated circuit layout; integration; three-dimensional integrated circuits; 3D chip stacking; accelerators; advanced silicon technology; early chip planning; floorplanning challenges; high level design; high level layout; multiple cores; server system designers; Industries; Multi-stage noise shaping; Scalability;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference (SOCC), 2011 IEEE International
Conference_Location
Taipei
ISSN
2164-1676
Print_ISBN
978-1-4577-1616-4
Electronic_ISBN
2164-1676
Type
conf
DOI
10.1109/SOCC.2011.6085096
Filename
6085096
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