• DocumentCode
    2392492
  • Title

    Floorplanning challenges in early chip planning

  • Author

    Shin, Jeonghee ; Darringer, John A. ; Luo, Guojie ; Aharoni, Merav ; Lvov, Alexey Y. ; Nam, Gi-Joon ; Healy, Michael B.

  • Author_Institution
    IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2011
  • fDate
    26-28 Sept. 2011
  • Firstpage
    388
  • Lastpage
    393
  • Abstract
    Early chip planning is becoming more critical as server system designers strive to explore a large design space with multiple cores and accelerators in an advanced silicon technology that includes 3D chip stacking. During early chip planning, designers search for the high-level design and layout that best satisfies a myriad of constraints and targets. In this paper, we discuss our experience in applying traditional floorplanning tools at this early stage and suggest how they might be adapted for early floorplanning.
  • Keywords
    integrated circuit layout; integration; three-dimensional integrated circuits; 3D chip stacking; accelerators; advanced silicon technology; early chip planning; floorplanning challenges; high level design; high level layout; multiple cores; server system designers; Industries; Multi-stage noise shaping; Scalability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference (SOCC), 2011 IEEE International
  • Conference_Location
    Taipei
  • ISSN
    2164-1676
  • Print_ISBN
    978-1-4577-1616-4
  • Electronic_ISBN
    2164-1676
  • Type

    conf

  • DOI
    10.1109/SOCC.2011.6085096
  • Filename
    6085096