• DocumentCode
    2392984
  • Title

    Restructurable VLSI-a demonstrated wafer-scale technology

  • Author

    Wyatt, Peter W. ; Raffel, Jack I.

  • Author_Institution
    MIT Lincoln Lab., Lexington, MA, USA
  • fYear
    1989
  • fDate
    3-5 Jan 1989
  • Firstpage
    13
  • Lastpage
    20
  • Abstract
    Restructurable VLSI (RVLSI) is an approach to wafer-scale integration which has been demonstrated by building six different monolithic silicon, wafer-scale chips for signal processing applications. It is based on the implementation of redundancy by laser microwelding on a finished, tested, packaged wafer. The concept of RVLSI is discussed, the chips built to data are reviewed, and some of the major issues are introduced. Three other papers describe in more detail the laser technology, the software created to design, test, and restructure these systems, some of the knowledge acquired in designing and building the first six circuit types, and the current application of the techniques to new, much more complex designs
  • Keywords
    VLSI; laser beam machining; redundancy; RVLSI; circuit types; complex designs; laser microwelding; laser technology; redundancy; restructurable VLSI; signal processing; wafer-scale integration; wafer-scale technology; Application software; Circuit testing; Optical design; Packaging; Paper technology; Signal processing; Silicon; Software design; Very large scale integration; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-8186-9901-9
  • Type

    conf

  • DOI
    10.1109/WAFER.1989.47531
  • Filename
    47531