• DocumentCode
    2393428
  • Title

    A cell-electrode interface noise model for high-density microelectrode arrays

  • Author

    Joye, Neil ; Schmid, Alexandre ; Leblebici, Yusuf

  • Author_Institution
    Microelectron. Syst. Laboratroy, Swiss Fed. Inst. of Technol. (EPFL), Lausanne, Switzerland
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    3247
  • Lastpage
    3250
  • Abstract
    A cell-electrode interface noise model is developed which is dedicated to enable the co-simulation of the cell-electrode electrical characteristics, along with the electronics of novel CMOS-based MEA. The electrode noise is investigated for Pt and Pt black electrodes. It is shown that the electrode noise can be the dominant noise source in the full system. Moreover, Pt black electrodes benefit from up to 5 muVrms decrease of the electrode output noise, for small electrodes. Furthermore, the cell-electrode interface noise spectral density is shown to be 10 dB to 20 dB larger at 1 kHz when a cell is lying on top of the electrode. This increase depends on the neural cell adhesion on the MEA surface.
  • Keywords
    CMOS integrated circuits; adhesion; bioelectric phenomena; biomedical electrodes; biomedical electronics; biomedical measurement; cellular biophysics; microelectrodes; neurophysiology; platinum; CMOS-based MEA electronics; Pt; black electrodes; cell-electrode interface noise model; electrical characteristics; high-density microelectrode arrays; neural activity measurement; neural cell adhesion; platinum electrode noise; Action Potentials; Algorithms; Amplifiers, Electronic; Computer Simulation; Electrodes; Electronics, Medical; Equipment Design; Humans; Microelectrodes; Models, Neurological; Neurons; Signal Processing, Computer-Assisted; Time Factors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5333534
  • Filename
    5333534