• DocumentCode
    2393958
  • Title

    A new bed-exiting alarm system for welfare facility residents

  • Author

    Ogawa, Hidekuni ; Yonezawa, Yoshiharu ; Maki, Hiromichi ; Caldwell, W. Morton

  • Author_Institution
    Dept. of Health Sci., Hiroshima Inst. of Technol., Hiroshima, Japan
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    1734
  • Lastpage
    1737
  • Abstract
    A newly developed alarm system detects welfare facility residents leaving their beds, and does not respond to the care staff, who wear shoes or slippers. It employs a stainless steel tape electrode, several linear integrated circuits and a low-power 8-bit single chip microcomputer. The electrode, which is used as a bed-exiting detection sensor, is attached to the floor mat to record changes in the always-present AC (alternating current) voltage induced on the patient´s body by electrostatic coupling from the standard 100 volt, 60 Hz AC utility power wiring in the room walls and ceiling. The resident´s body movements, before trying to get out of bed and after leaving the bed, are detected by the microcomputer from changes in the induced AC voltage. The microcomputer alerts the care staff station, via a power line communication system or PHS (personal handy phone system).
  • Keywords
    alarm systems; bioelectric phenomena; biomechanics; biomedical electrodes; carrier transmission on power lines; electric sensing devices; integrated circuits; microcomputers; mobile handsets; patient monitoring; telemedicine; alternating current voltage; bed-exiting alarm system; body movements; care staff station; electrostatic coupling; linear integrated circuits; microcomputer; personal handy phone system; power line communication system; stainless steel tape electrode; welfare facility residents; Electrodes; Microcomputers; Nursing Homes; Security Measures; Social Welfare; Static Electricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5333562
  • Filename
    5333562