DocumentCode
2394086
Title
High-pressure polycrystalline diamond as a cost effective heat spreader
Author
Dahlgren, Scott S. ; Hall, H. Tracy, Jr.
Author_Institution
Novatek, Provo, UT, USA
Volume
1
fYear
2000
fDate
2000
Lastpage
303
Abstract
Diamond is an ideal material for heat spreading applications; CVD PCD is many times more expensive than high pressure PCD because it grows much slower and the material cost is higher. High-pressure PCD can be produced in large quantities and molded into shapes at a reasonable price. Novatek´s patented high pressure synthesis process produces PCD with a conductivity of 700 W/m°K, almost twice that of copper. Diamond heat spreaders are most effective in applications producing high heat flux densities. Diamond becomes far more conductive than metals at cryogenic temperatures. The thermal junction between the IC and the heat sink is a predominant thermal resistance. High pressure diamond has favorable thermal expansion and stiffness coefficients and is easily pre-metalized insitu, making it a good material for direct bonding to the IC
Keywords
diamond; heat sinks; thermal conductivity; thermal resistance; C; IC bonding; heat sink; heat spreader; high-pressure polycrystalline diamond; stiffness coefficient; thermal conductivity; thermal expansion; thermal junction; thermal resistance; Conducting materials; Conductivity; Copper; Costs; Cryogenics; Heat sinks; Resistance heating; Shape; Temperature; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location
Las Vegas, NV
ISSN
1089-9870
Print_ISBN
0-7803-5912-7
Type
conf
DOI
10.1109/ITHERM.2000.866839
Filename
866839
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