• DocumentCode
    2394086
  • Title

    High-pressure polycrystalline diamond as a cost effective heat spreader

  • Author

    Dahlgren, Scott S. ; Hall, H. Tracy, Jr.

  • Author_Institution
    Novatek, Provo, UT, USA
  • Volume
    1
  • fYear
    2000
  • fDate
    2000
  • Lastpage
    303
  • Abstract
    Diamond is an ideal material for heat spreading applications; CVD PCD is many times more expensive than high pressure PCD because it grows much slower and the material cost is higher. High-pressure PCD can be produced in large quantities and molded into shapes at a reasonable price. Novatek´s patented high pressure synthesis process produces PCD with a conductivity of 700 W/m°K, almost twice that of copper. Diamond heat spreaders are most effective in applications producing high heat flux densities. Diamond becomes far more conductive than metals at cryogenic temperatures. The thermal junction between the IC and the heat sink is a predominant thermal resistance. High pressure diamond has favorable thermal expansion and stiffness coefficients and is easily pre-metalized insitu, making it a good material for direct bonding to the IC
  • Keywords
    diamond; heat sinks; thermal conductivity; thermal resistance; C; IC bonding; heat sink; heat spreader; high-pressure polycrystalline diamond; stiffness coefficient; thermal conductivity; thermal expansion; thermal junction; thermal resistance; Conducting materials; Conductivity; Copper; Costs; Cryogenics; Heat sinks; Resistance heating; Shape; Temperature; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-5912-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2000.866839
  • Filename
    866839