Analysis of interconnect and package structures using PEEC models with radiated emissions

Author

Pinello, W. ; Ruehli, Albert ; Cangellaris, A.

Author_Institution

Dept. of Electr. & Comput. Eng., Arizona Univ., AZ, USA

fYear

1997

fDate

18-22 Aug 1997

Firstpage

353

Lastpage

358

Abstract

The PEEC (partial element equivalent circuit) approach is well suited for the modeling of integrated circuits and system interconnect and packages. In this paper, techniques which incorporate the latest enhancements of the PEEC approach are applied to EMI and electrical interconnect and package (EIP) example problems. Our approach corresponds to a full wave solution, which accurately determines the high frequency and also the time domain currents and voltages. Two examples are given to illustrate the usefulness of the techniques for both transient and frequency domain electromagnetic simulation as well as for radiated field calculation

Keywords

electromagnetic interference; equivalent circuits; frequency-domain analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; time-domain analysis; transient analysis; EMI; frequency domain electromagnetic simulation; full wave solution; integrated circuits; interconnect and package structures; partial element equivalent circuit; radiated emissions; radiated field calculation; time domain currents; time domain voltages; transient domain electromagnetic simulation; Electromagnetic fields; Electromagnetic interference; Electromagnetic radiation; Electromagnetic transients; Equivalent circuits; Frequency domain analysis; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit packaging; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1997. IEEE 1997 International Symposium on

Conference_Location

Austin, TX

Print_ISBN

0-7803-4140-6

Type

conf

DOI

10.1109/ISEMC.1997.667703

Filename

667703