DocumentCode
2396786
Title
A life cycle model for the WSI associative string processor (WASP)
Author
Peacock, Chris ; Bolouri, Hamid ; Lea, Mike
Author_Institution
Eng. Res. & Dev. Centre, Hertfordshire Univ., Hatfield, UK
fYear
1995
fDate
18-20 Jan 1995
Firstpage
52
Lastpage
61
Abstract
The paper presents a comprehensive life cycle model for the WSI associative string processor (WASP) which simulates the manufacture, acceptance, and operational life of a hypothetical target device. After 100,000 hours of continuous simulated operation, the device is shown to support an average of over 8.5 K APEs per wafer under a worst case scenario, and an average of over 12 K APEs per wafer under an expected case scenario
Keywords
associative processing; wafer-scale integration; 100000 hour; WASP; WSI associative string processor; acceptance; life cycle model; manufacture; operational life; simulation; target device; Circuit faults; Fault tolerance; Integrated circuit interconnections; Life testing; Manufacturing processes; Predictive models; Pulp manufacturing; Research and development; Semiconductor device modeling; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-2467-6
Type
conf
DOI
10.1109/ICWSI.1995.515438
Filename
515438
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