• DocumentCode
    2397141
  • Title

    Teaching the efficient use of hybrid-WSI technology

  • Author

    Thiel, Andreas ; Habiger, Claus ; Thaler, Markus ; Tröster, Gerhard

  • Author_Institution
    Electron. Lab., Swiss Federal Inst. of Technol., Zurich, Switzerland
  • fYear
    1995
  • fDate
    18-20 Jan 1995
  • Firstpage
    72
  • Lastpage
    81
  • Abstract
    It has become increasingly clear that electronic packaging sets important bounds on system cost and performance. As is evident from Mukund et al. (1993) and Habiger et al. (1993), WSI and hybrid WSI design has recently become a major focus of research activities. Due to its inherent interdisciplinarity a subject like WSI design or in more general electronic packaging does not easily fit into the traditional curricula of university engineering courses. The obvious needs to overcome this lack in engineering education led to the introduction of a new lecture series at ETH Zurich. This paper describes the course content and summarizes the experiences gained from this new educational approach. The major focus of the presented paper is on the description of the home- and lab-work provided additionally to the lecture series
  • Keywords
    educational courses; electronic engineering education; hybrid integrated circuits; integrated circuit packaging; teaching; wafer-scale integration; ETH Zurich; electronic packaging; engineering education; hybrid-WSI technology; teaching; university courses; Costs; Design engineering; Electronic packaging thermal management; Electronics packaging; Engineering education; Laboratories; Printed circuits; System performance; Time to market; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-2467-6
  • Type

    conf

  • DOI
    10.1109/ICWSI.1995.515440
  • Filename
    515440