DocumentCode
2397141
Title
Teaching the efficient use of hybrid-WSI technology
Author
Thiel, Andreas ; Habiger, Claus ; Thaler, Markus ; Tröster, Gerhard
Author_Institution
Electron. Lab., Swiss Federal Inst. of Technol., Zurich, Switzerland
fYear
1995
fDate
18-20 Jan 1995
Firstpage
72
Lastpage
81
Abstract
It has become increasingly clear that electronic packaging sets important bounds on system cost and performance. As is evident from Mukund et al. (1993) and Habiger et al. (1993), WSI and hybrid WSI design has recently become a major focus of research activities. Due to its inherent interdisciplinarity a subject like WSI design or in more general electronic packaging does not easily fit into the traditional curricula of university engineering courses. The obvious needs to overcome this lack in engineering education led to the introduction of a new lecture series at ETH Zurich. This paper describes the course content and summarizes the experiences gained from this new educational approach. The major focus of the presented paper is on the description of the home- and lab-work provided additionally to the lecture series
Keywords
educational courses; electronic engineering education; hybrid integrated circuits; integrated circuit packaging; teaching; wafer-scale integration; ETH Zurich; electronic packaging; engineering education; hybrid-WSI technology; teaching; university courses; Costs; Design engineering; Electronic packaging thermal management; Electronics packaging; Engineering education; Laboratories; Printed circuits; System performance; Time to market; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-2467-6
Type
conf
DOI
10.1109/ICWSI.1995.515440
Filename
515440
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