CCD wafer scale integration

Author

Suni, Paul P.

Author_Institution

Orbit Semicond. Inc., Sunnyvale, CA, USA

fYear

1995

fDate

18-20 Jan 1995

Firstpage

123

Lastpage

133

Abstract

Wafer scale CCD photodetector arrays of 26 million pixels or more are being fabricated on a limited production basis today. This paper provides an introduction to CCD wafer scale integration with an emphasis on common wafer scale CCD design architectures, applications and fabrication processes. Examples of wafer scale CCD products are reviewed, and a triple poly, double metal wafer scale CCD fabrication process is discussed in comparison with typical digital CMOS processes. Very large area CCD photodetector arrays designed and fabricated by Orbit Semiconductor are discussed in some detail. These include an 8 million pixel 3 cm by 6 cm wafer scale CCD imager for digital photography and a family of CCD sensors for intraoral digital dental radiography. Finally, future possibilities in wafer scale CCD´s are discussed

Keywords

CCD image sensors; integrated circuit design; integrated circuit technology; wafer-scale integration; 26 Mpixel; 3 cm; 6 cm; 8 Mpixel; CCD imager; CCD photodetector arrays; CCD sensors; CCD wafer scale integration; Orbit Semiconductor; design architectures; digital photography; intraoral digital dental radiography; triple poly double metal fabrication; CMOS process; Charge coupled devices; Charge-coupled image sensors; Dentistry; Digital photography; Fabrication; Photodetectors; Pixel; Production; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-2467-6

Type

conf

DOI

10.1109/ICWSI.1995.515446

Filename

515446