DocumentCode
239784
Title
IEEE student quality improvement program: To improve the employability rate of students
Author
Hameed, Shahul ; Nileena, G.S.
Author_Institution
Dept. of Comput. Sci., Coll. of Eng., Alappuzha, India
fYear
2014
fDate
19-20 Dec. 2014
Firstpage
219
Lastpage
222
Abstract
In India, a large percentage of graduating engineers are not industry ready. The primary reason is that the colleges have outdated syllabi leading to a wide gap between the curriculum and the requirements of industry. Students who take up internships are very few among Tier-2 and Tier-3 colleges. All these problems result in graduates who are unemployable without training in basic skills by the industry. An internship could help the students in overcoming many of these shortcomings as they learn about corporate industries and receive basic training. This paper presents a novel initiative towards this end by the IEEE Student Branch, College of Engineering, Chengannur. It aims at spreading awareness about the advantages of taking up internship opportunities, providing the basic training and helping students get internships. The program was a huge success and helped a large number of students in securing internship offers. This model, if replicated in other colleges could significantly improve the employability of students and help them improve their academic performance and engineering skill sets.
Keywords
educational institutions; employment; engineering education; further education; on-the-job training; Chengannur; College of Engineering; IEEE Student Branch; IEEE student quality improvement program; India; colleges; graduating engineers; internships; student employability rate; Companies; Conferences; Educational institutions; Industries; Resumes; Technological innovation; Training; college initiatives; employability; engineering education; industry collaboration; industry-academic interaction; internships; placements;
fLanguage
English
Publisher
ieee
Conference_Titel
MOOC, Innovation and Technology in Education (MITE), 2014 IEEE International Conference on
Conference_Location
Patiala
Type
conf
DOI
10.1109/MITE.2014.7020275
Filename
7020275
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