• DocumentCode
    2398147
  • Title

    Achieving the enhanced reliability of electronic system by application of EMI control measures

  • Author

    Deb, G.K.

  • Author_Institution
    Electron. Res. & Dev. Centre of India, Calcutta, India
  • fYear
    1997
  • fDate
    18-22 Aug 1997
  • Firstpage
    439
  • Lastpage
    443
  • Abstract
    EMC is practiced in efficient operation, maintenance of reliability and safety of various electronic systems used in military and civil sectors and medicare. In the Indian context, it is essential to make indigenous products acceptable and competitive in domestic and international markets, especially in the European union, by designing reliable equipment. This paper addresses the following: (a) quality control for VLSI based systems through good EMC design practices, (b) sub-system module packaging, (c) hardening of electronic components for EMC and reliability, (d) protection of transient effects on digital circuits, (e) component-value-optimisation and (f) EMC maintenance considerations. The measurement results complying with the FCC specifications (class B) are included for a microprocessor subsystem
  • Keywords
    VLSI; electromagnetic compatibility; electromagnetic interference; interference suppression; maintenance engineering; microprocessor chips; packaging; quality control; reliability; safety; EMC; EMC design practices; EMC maintenance considerations; EMI control measures; FCC specifications; India; VLSI based systems; civil sector; class B specifications; component-value-optimisation; digital circuits; efficient operation; electronic components hardening; electronic system; maintenance; microprocessor subsystem; military sector; quality control; reliability enhancement; safety; sub-system module packaging; transient effects protection; Digital circuits; Electromagnetic compatibility; Electronic components; Electronics packaging; Maintenance; Packaging machines; Protection; Quality control; Safety; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1997. IEEE 1997 International Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-4140-6
  • Type

    conf

  • DOI
    10.1109/ISEMC.1997.667720
  • Filename
    667720