DocumentCode
2399282
Title
IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370)
fYear
1998
fDate
26-28 Oct. 1998
Abstract
The following topics were dealt with: system design issues; on-chip interconnections; measurements; mixed signal and optical packaging design; power distribution modelling; simultaneous switching noise; power supply decoupling; substrate modelling; microwave packaging; modelling techniques; accelerated modelling
Keywords
packaging; accelerated modelling; electrical performance; electronic packaging; measurements; microwave packaging; mixed signal packaging; modelling techniques; on-chip interconnections; optical packaging design; power distribution modelling; power supply decoupling; simultaneous switching noise; substrate modelling; system design issues;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location
West Point, NY, USA
Print_ISBN
0-7803-4965-2
Type
conf
DOI
10.1109/EPEP.1998.733470
Filename
733470
Link To Document