Title :
Low cost IC-package for 2.5-10 GBit/s 1310 nm VCSEL with single mode coupling
Author :
Melchior, Lutz ; Plickert, Volker ; Althasu, H.-L. ; Steinle, Gunther ; Scholz, Robert ; Weigert, Martin
Abstract :
For longer distances single mode coupled 1310 nm or 1550nm FP or DFB lasers are used. A couple of companies are working on the 1310 nm VCSEL to replace the FP and DFB lasers to reduce cost and gain performance. The main advantages of the 1310 nm VCSELs are lower chip cost, lower packaging cost, lower power consumption and a very low threshold current. The extremely short opto-mechanical design gives an excellent HF-performance for 2.5 Gbps up to 10 Gbps applications. The flexboard interconnection avoids mechanical overdeterminations.
Keywords :
integrated circuit packaging; integrated optics; integrated optoelectronics; laser modes; optical design techniques; power consumption; surface emitting lasers; 1310 nm; 2.5 Gbit/s to 10 Gbit/s; VCSEL chip; flexboard interconnection; low cost IC-packaging; opto-mechanical design; power consumption; single mode coupling; Assembly; Costs; Laser modes; Lead; Optical coupling; Optical design; Optical pumping; Plastic packaging; Vertical cavity surface emitting lasers; Welding;
Conference_Titel :
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
Print_ISBN :
0-7803-7888-1
DOI :
10.1109/LEOS.2003.1252928