Title :
Imaging system-on-chip: design and applications
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., CA, USA
Abstract :
Recently developed CMOS image sensors offer the promise of ultra-low power consumption and camera-on-chip integration in standard fabrication processes. In this paper by combining the components of a multichip imaging system on a single chip does not take full advantage of integration, especially given its inherent complexity is demonstrated. Integration is most beneficial when the system is architected to bring processing closer to sensing so as to achieve higher performance or perform novel functionality. We demonstrate this point using three imaging system-on-chip examples. The first is a recently designed ultra-wide dynamic range video imaging system-on-chip that integrates a digital pixel sensor (DPS), a frame buffer, and digital signal processors. The second example is an integrated chemi-luminescence detection chip and the third is a vertically integrated IR imaging system that we are currently designing.
Keywords :
CMOS image sensors; chemiluminescence; digital signal processing chips; infrared imaging; integrated circuit design; integrated optoelectronics; optical design techniques; photodetectors; system-on-chip; CMOS image sensor; camera-on-chip integration; digital pixel sensor; digital signal processor; imaging system-on-chip; integrated chemiluminescence detection chip; multichip imaging system; ultra-wide dynamic range video imaging system-on-chip design; vertical integrated IR imaging system; CMOS image sensors; Dynamic range; Energy consumption; Fabrication; Image sensors; Optical imaging; Pixel; Signal design; Standards development; System-on-a-chip;
Conference_Titel :
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
Print_ISBN :
0-7803-7888-1
DOI :
10.1109/LEOS.2003.1252988