• DocumentCode
    2400937
  • Title

    Increasing yields with in-tool ionization

  • Author

    Steinman, Arnold

  • Author_Institution
    1321 Walnut Street, Berkeley California 94709 USA
  • fYear
    2009
  • fDate
    10-12 May 2009
  • Firstpage
    164
  • Lastpage
    168
  • Abstract
    Smaller feature dimensions of semiconductor devices mean that ldquokiller particlerdquo sizes are also smaller. Static charge affects process yields by increased attraction of these smaller particles to critical product surfaces. This paper describes a study that establishes the affect of charge neutralization in reducing Particles per Wafer Pass (PWP). Cost of ownership analysis shows the positive results on yield and return on investment (ROI).
  • Keywords
    electrostatics; ionisation; semiconductor device manufacture; semiconductor devices; charge neutralization; feature dimensions; in-tool ionization; particles per wafer pass; process yield; semiconductor devices; static charge; Charge transfer; Contamination; Costs; Electrostatic discharge; Ionization; Metrology; Monitoring; Production; Qualifications; Statistical analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
  • Conference_Location
    Berlin
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-3614-9
  • Electronic_ISBN
    1078-8743
  • Type

    conf

  • DOI
    10.1109/ASMC.2009.5155976
  • Filename
    5155976