DocumentCode
2400937
Title
Increasing yields with in-tool ionization
Author
Steinman, Arnold
Author_Institution
1321 Walnut Street, Berkeley California 94709 USA
fYear
2009
fDate
10-12 May 2009
Firstpage
164
Lastpage
168
Abstract
Smaller feature dimensions of semiconductor devices mean that ldquokiller particlerdquo sizes are also smaller. Static charge affects process yields by increased attraction of these smaller particles to critical product surfaces. This paper describes a study that establishes the affect of charge neutralization in reducing Particles per Wafer Pass (PWP). Cost of ownership analysis shows the positive results on yield and return on investment (ROI).
Keywords
electrostatics; ionisation; semiconductor device manufacture; semiconductor devices; charge neutralization; feature dimensions; in-tool ionization; particles per wafer pass; process yield; semiconductor devices; static charge; Charge transfer; Contamination; Costs; Electrostatic discharge; Ionization; Metrology; Monitoring; Production; Qualifications; Statistical analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
Conference_Location
Berlin
ISSN
1078-8743
Print_ISBN
978-1-4244-3614-9
Electronic_ISBN
1078-8743
Type
conf
DOI
10.1109/ASMC.2009.5155976
Filename
5155976
Link To Document