DocumentCode
2401445
Title
Boundary of power-MOSFET, unclamped inductive-switching (UIS), avalanche-current capability
Author
Stoltenburg, Rodney R.
Author_Institution
Harris Semicond., Mountaintop, PA, USA
fYear
1989
fDate
13-17 Mar 1989
Firstpage
359
Lastpage
364
Abstract
The avalanche-current capability of a new class of power MOSFETs called MegaFETs is characterized under UIS (unclamped inductive switching) conditions. These devices are shown to be limited in avalanche current only when the junction temperature exceeds the intrinsic temperature of 425°C. Second breakdown is shown to occur independent of the parasitic bipolar transistor. The devices tested exhibit a cubic relationship between the maximum avalanche current and inductance, which represents a nonconstant energy capability. This maximum current decreases linearly with initial junction temperature, indicating a thermally initiated failure mechanism. The maximum junction temperature at failure was found to be 400-450°C. The power-supply voltage reduces the maximum avalanche current by increasing the time in avalanche. The current capability is also proportional to total die area when the avalanche time is constant. The avalanche-current capability of a planar diode was found to verify that parasitic bipolar turn-on is not necessary to cause second breakdown. Second breakdown due to the thermal generation of carriers represents the limiting boundary of power-MOSFET avalanche-current capability
Keywords
insulated gate field effect transistors; power transistors; 400 to 450 degC; MegaFET; avalanche-current capability; junction temperature; parasitic bipolar transistor; power-MOSFET; power-supply voltage; second breakdown; thermally initiated failure mechanism; unclamped inductive-switching; Bipolar transistors; Diodes; Electric breakdown; Failure analysis; Inductance; MOSFETs; Power generation; Temperature; Testing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 1989. APEC' 89. Conference Proceedings 1989., Fourth Annual IEEE
Conference_Location
Baltimore, MD
Type
conf
DOI
10.1109/APEC.1989.36987
Filename
36987
Link To Document