DocumentCode
2402503
Title
The 3-D computer
Author
Little, M.J. ; Etchells, R.D. ; Grinberg, J. ; Laub, S.P. ; Nash, J.G. ; Yung, M.W.
Author_Institution
Hughes Res. Lab., Malibu, CA, USA
fYear
1989
fDate
3-5 Jan 1989
Firstpage
55
Lastpage
64
Abstract
The 3-D Computer is an implementation of a cellular array processor. Two technologies which make possible massive numbers of communication channels both between silicon wafers and through them have been developed. A parallel processor (single-instruction-multiple-data stream cellular array processor) has been designed and built to demonstrate the potential of this technological approach. While the 3-D computer which has been built and operated is a small-scale implementation relative to the long-term aims of this technology, it is nevertheless an extremely powerful computer. The current feasibility demonstration 3-D Computer is a 32×32 array of processors partitioned over five wafers stacked one on top of another. The throughput of this machine is >600 million operations per second with a 10-MHz clock, while the projected throughput of a full-scale machine is >100 billion operations per second, again with a 10-MHz clock
Keywords
VLSI; cellular arrays; microprocessor chips; parallel processing; 10 MHz; 3-D Computer; cellular array processor; communication channels; parallel processor; single-instruction-multiple-data stream; throughput; wafers;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
0-8186-9901-9
Type
conf
DOI
10.1109/WAFER.1989.47536
Filename
47536
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