Electrical and thermal layout design considerations for integrated power electronics modules

Author

Chen, Jonah Zhou ; Pang, Ying Feng ; Boroyevich, Dushan ; Scott, Elaine P. ; Thole, Karen A.

Author_Institution

Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

Volume

1

fYear

2002

fDate

13-18 Oct. 2002

Firstpage

242

Abstract

A methodology was developed to optimize the 3D geometrical design layout of an active integrated power electronics module (IPEM) by considering both electrical and thermal performance. This paper is focused on the electrical analysis, including the parasitic extraction done by the Maxwell Q3D Extractor. A parametric study was conducted to determine the common model EMI noise of several different layouts. The final design layout was achieved after tradeoff between electrical and thermal performance.

Keywords

DC-DC power convertors; electromagnetic compatibility; electromagnetic interference; integrated circuit layout; power integrated circuits; thermal analysis; 3D geometrical design layout; DC/DC power conversion; Maxwell Q313 Extractor; active integrated power electronics modules; common model EMI noise; electrical layout design considerations; electrical performance; parametric study; thermal layout design considerations; thermal performance; Circuit simulation; Computational modeling; Costs; DC-DC power converters; Electromagnetic interference; Electronic packaging thermal management; Inductance; Parasitic capacitance; Power electronics; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 2002. 37th IAS Annual Meeting. Conference Record of the

Conference_Location

Pittsburgh, PA, USA

ISSN

0197-2618

Print_ISBN

0-7803-7420-7

Type

conf

DOI

10.1109/IAS.2002.1044095

Filename

1044095