Title :
Frequency-dependent crosstalk modeling for on-chip interconnections
Author :
Deutsch, A. ; Smith, H. ; Surovic, C.W. ; Kopcsay, G.V. ; Webber, D.A. ; Katopis, G.A. ; Becker, W.D. ; Coteus, P.W. ; Dansky, A.H. ; Sai-Halasz, G.A.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
An extensive study of crosstalk simulation issues for on-chip interconnections was performed for representative six-layer Al(Cu) structures. Guidelines are given for the range of conditions when R(f)L(f)C vs. RLC vs. RC representations are valid. Examples are also given of realistic short and long coupled-section interactions and the effect of in-plane neighbouring connections is discussed. Signal propagation and crosstalk are analyzed over the temperature range -160°C to +100°C and it is shown that Al(Cu) wiring can sustain 4.44 GHz processor frequency at T=+25°C operation
Keywords :
aluminium alloys; circuit simulation; copper alloys; crosstalk; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; integrated circuit modelling; thermal analysis; -160 to 100 C; 25 C; 4.44 GHz; Al(Cu) wiring; AlCu; condition representations; coupled-section interactions; crosstalk; crosstalk simulation; frequency-dependent crosstalk modeling; in-plane neighbouring connections; on-chip interconnections; operating temperature; processor frequency; signal propagation; six-layer Al(Cu) structures; temperature range; Conductivity; Crosstalk; Delay; Electrical resistance measurement; Frequency; Guidelines; Impedance; Signal processing; Testing; Wiring;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733744
