• DocumentCode
    2404625
  • Title

    A quantum thermomechanical modeling of band offsets and Schottky barriers of semiconductor heterostructures

  • Author

    Ünlü, Hilmi

  • Author_Institution
    Dept. of Phys., Istanbul Tech. Univ., Turkey
  • Volume
    2
  • fYear
    1998
  • fDate
    6-10 Oct 1998
  • Firstpage
    393
  • Abstract
    Using the extended universal tight binding model of semiconductors a new way of determining the band offsets and Schottky barrier heights in semiconductor heterostructures is presented. The band offsets and Schottky barriers are first determined by aligning the vacuum level, defined relative to valence band maximum and screened by optical dielectric constant of semiconductors, on both sides of heterojunction at zero temperature and standard pressure. The temperature, strain and pressure effects on band offsets and Schottky barriers are then obtained using the two statistical thermodynamic postulates: (i) the free electrons and holes are electrically charged weakly interacting quasichemical particles and (ii) the electron-hole pairs are generated by the charge transfer from bonding (valencelike) states to antibonding (conduction-like) states. Excellent agreement is obtained Between the model predictions and experiment for band offsets at interfaces between AlAs and GaAs and between HgTe and CdTe, as well as other heterojunctions and Schottky barriers
  • Keywords
    Schottky barriers; semiconductor heterojunctions; tight-binding calculations; AlAs-GaAs; HgTe-CdTe; Schottky barrier; band offset; quantum thermomechanical model; semiconductor heterostructure; tight binding model; Capacitive sensors; Charge carrier processes; Dielectric constant; Electron optics; Heterojunctions; Pressure effects; Schottky barriers; Temperature distribution; Thermodynamics; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference, 1998. CAS '98 Proceedings. 1998 International
  • Conference_Location
    Sinaia
  • Print_ISBN
    0-7803-4432-4
  • Type

    conf

  • DOI
    10.1109/SMICND.1998.733770
  • Filename
    733770