Title :
Shape evolution during through-mask electrochemical micromachining at low and high aspect ratio
Author :
Dikusar, A.L. ; Keloglu, O.Yu. ; Yushchenko, S.P.
Author_Institution :
Inst. of Appl. Phys., Acad. of Sci., Kishinev, Moldova
Abstract :
Shape evolution during through-mask electrochemical micromachining was investigated to study the problem of dissolution (electrodeposition) uniformity at low and high aspect ratio. Mathematical model to predict shape evolution by assuming primary current distribution is advanced. The results of calculation are compared with the experimental data on anodic dissolution of copper in neutral nitrate solutions
Keywords :
dissolving; electrodeposition; masks; micromachining; Cu; anodic dissolution; aspect ratio; copper; current distribution; electrodeposition; mathematical model; neutral nitrate solution; shape evolution; through-mask electrochemical micromachining; Copper; Current distribution; Dielectrics and electrical insulation; Electrodes; Etching; Mathematical model; Metal-insulator structures; Micromachining; Resists; Shape;
Conference_Titel :
Semiconductor Conference, 1998. CAS '98 Proceedings. 1998 International
Conference_Location :
Sinaia
Print_ISBN :
0-7803-4432-4
DOI :
10.1109/SMICND.1998.733811
