Title :
A novel high isolation interconnect for broadband mixed signal silicon MMICs
Author :
Qian, Yongxi ; Chang, M. Frank ; Itoh, Tatsuo
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Abstract :
A novel interconnect and packaging concept for high-density, broadband mixed signal silicon MMICs is presented. Compared to conventional microstrip or stripline-based structures, the proposed silicon/metal/polyimide (SIMPOL) interconnect is very promising for extremely high isolation (>100 dB) between adjacent channels from DC up to 50 GHz, as indicated by simulations using a pre-verified full-wave FDTD code
Keywords :
MMIC; circuit simulation; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; isolation technology; mixed analogue-digital integrated circuits; polymer films; 0 Hz to 50 GHz; SIMPOL interconnect; Si; adjacent channel isolation; broadband mixed signal silicon MMICs; high isolation interconnect; high-density mixed signal silicon MMICs; interconnect; isolation; microstrip-based structures; packaging; pre-verified full-wave FDTD code; silicon/metal/polyimide interconnect; simulation; stripline-based structures; Crosstalk; Integrated circuit interconnections; MMICs; Microstrip; Packaging; Polyimides; RF signals; Radio frequency; Silicon; Stripline;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733839
