DocumentCode :
2406379
Title :
Temperature stable thermoplastic microwave materials and copper laminates
Author :
Walpita, L.M. ; Ahern, M. ; Chen, P. ; Goldberg, H. ; Weinberg, S. ; Zipp, C. ; Adams, G. ; Wong, Y.-H.
Author_Institution :
Hoechst Res. & Technol., Summit, NJ, USA
fYear :
1998
fDate :
26-28 Oct 1998
Firstpage :
93
Lastpage :
96
Abstract :
High dielectric constant materials are increasingly needed in microwave circuit miniaturization for outdoor and indoor wireless applications. In this presentation, temperature stable high dielectric constant thermoplastic polymer compositions and copper laminated sheets made from these compositions for wireless applications are introduced. The compositions are made by mixing suitable ceramics and polymers. The design, fabrication and properties of these compositions and some applications, including antennas and filters, are discussed. The effect of temperature on the resonance frequency of patch antennas made from the copper laminated high dielectric constant composite sheets are also discussed
Keywords :
ceramics; copper; filled polymers; laminates; microstrip antennas; microwave antennas; microwave filters; microwave materials; permittivity; resonance; thermal stability; antennas; ceramic/polymer mixture; composition design; composition fabrication; composition properties; copper laminated high dielectric constant composite sheets; copper laminated sheets; copper laminates; filters; high dielectric constant materials; high dielectric constant thermoplastic polymer compositions; indoor wireless applications; microwave circuit miniaturization; outdoor wireless applications; patch antennas; resonance frequency; temperature effects; temperature stable thermoplastic microwave materials; wireless applications; Ceramics; Copper; Dielectric materials; Fabrication; Filters; High-K gate dielectrics; Microwave circuits; Polymers; Sheet materials; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
Type :
conf
DOI :
10.1109/EPEP.1998.733861
Filename :
733861
Link To Document :
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