Title :
Skin effects models for transmission line structures using generic SPICE circuit simulators
Author :
Sen, Bidyut K. ; Wheeler, Richard L.
Author_Institution :
Sun Microsyst. Inc., Palo Alto, CA, USA
Abstract :
A recipe has been developed to model the skin effect for various transmission line structures. The final circuit structure to model this effect can be used with a generic SPICE circuit simulator. The ladder-like network (Yen et al, 1982) element is fairly easy to compute, and requires a minimal increase in CPU time. The model has been verified experimentally
Keywords :
SPICE; circuit simulation; coaxial cables; integrated circuit interconnections; integrated circuit packaging; ladder networks; skin effect; transmission line theory; CPU time; circuit structure; coaxial cables; generic SPICE circuit simulators; ladder-like network element; model verification; skin effect; skin effect models; transmission line structures; Circuit simulation; Coaxial cables; Conductors; Distributed parameter circuits; Electronic mail; Frequency; Inductance; Integrated circuit interconnections; SPICE; Skin effect;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733910
