Title :
Incorporating vertical discontinuities in power-bus modeling using a mixed-potential integral equation and circuit extraction formulation
Author :
Fan, J. ; Shi, H. ; Drewniak, J.L. ; Hubing, T.H. ; DuBroff, R.E. ; Van Doren, T.P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA
Abstract :
Noise on the DC power-bus attributed to device switching is among the primary sources of EMI and signal integrity problems. A mixed-potential integral equation formulation with circuit extraction approach is used to model the planar multi-layer power-bus geometry, which can also include arbitrary shaped power regions on multiple layers. Incorporating vertical discontinuities, e.g. decoupling capacitor interconnects, is a critical aspect of the modeling, and must be done properly since they are included as a lumped element model and not as a part of the MPIE formulation. Agreement with experimental results verifies the validity of the present approach
Keywords :
capacitors; circuit analysis computing; circuit noise; driver circuits; electric field integral equations; electromagnetic interference; packaging; printed circuit design; DC power-bus noise; EMI; MPIE formulation; arbitrary shaped power regions; circuit extraction; circuit extraction formulation; decoupling capacitor interconnects; device switching; lumped element model; mixed-potential integral equation; modeling; multilayer PCBs; multiple layers; planar multi-layer power-bus geometry; power-bus modeling; signal integrity; vertical discontinuities; Capacitors; Circuit noise; Electromagnetic compatibility; Electromagnetic interference; Geometry; Integral equations; Laboratories; Metallization; Multi-stage noise shaping; Solid modeling;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733956