DocumentCode
2409474
Title
Case study of copper dendrite growth under HAST test
Author
Kim, Sang-Ah ; Ahn, Do-Seok ; Eum, Yong-Hui ; Kim, Duck-Hyun ; Kim, Young-Bae
Author_Institution
Failure Anal. Team, QRT Semicond., Ichon
fYear
2008
fDate
7-11 July 2008
Firstpage
1
Lastpage
3
Abstract
The HAST is performed for the purpose of evaluating the reliability of nonhermetic packaged solid-state devices in humid environments. This paper discusses the issue of copper dendrite growth, electrochemical migration, memory fuse box and die edge areas under HAST test.
Keywords
ball grid arrays; copper; dendrites; electromigration; environmental factors; semiconductor device reliability; semiconductor device testing; HAST test; copper dendrite growth; die edge; electrochemical migration; memory fuse box; nonhermetic packaged solid-state devices; Circuit testing; Copper; Failure analysis; Fuses; Humidity; Life estimation; Life testing; Moisture; Packaging; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location
Singapore
Print_ISBN
978-1-4244-2039-1
Electronic_ISBN
978-1-4244-2040-7
Type
conf
DOI
10.1109/IPFA.2008.4588167
Filename
4588167
Link To Document