Title :
Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds
Author :
Made, Riko I. ; Gan, Chee Lip ; Lee, Chengkuo ; Yan, Liling Yan ; Yu, Aibin ; Yoon, Seung Wook
Author_Institution :
Sch. of Mater. Sci. & Eng., Nanyang Technol. Univ., Singapore
Abstract :
Bonding of multiple indium-silver intermediate layers facilitates precise control of the formed alloy composition and the joint thickness. The bonding temperature and post-bonding re-melting temperature can thus be easily designed by controlling the multilayer materials and structure thicknesses. However, joining different materials involves the formation of intermetallics, which is known to be brittle. In this paper, In-Ag intermetallic phase formation under different applied pressure is studied.
Keywords :
chemical interdiffusion; indium alloys; lead bonding; multilayers; silver alloys; Ag-In; alloy composition; bond strengths; bonding pressure effect; bonding temperature; intermetallic phase formation; joint thickness; low temperature bonds; multilayer materials; post-bonding re-melting temperature; thermocompression bonding; Indium; Intermetallic; Nonhomogeneous media; Rough surfaces; Silver; Surface morphology; Surface roughness; Temperature; Thickness control; Wafer bonding;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
DOI :
10.1109/IPFA.2008.4588168
