DocumentCode :
2412115
Title :
SRAM cell reliability degradations due to cell crosstalk
Author :
Bae, Jongsun ; Baeg, Sanghyeon ; Wen, ShiJie ; Wong, Rick
Author_Institution :
Hanyang Univ. at Ansan, Ansan, South Korea
fYear :
2010
fDate :
17-21 Oct. 2010
Firstpage :
129
Lastpage :
132
Abstract :
The capacitance between adjacent SRAM cells due to defectivity can increase in smaller geometry technologies. However, the abnormal behaviors due to such defective capacitance in SRAM are often neglected and can cause NTF (No Trouble Found) failures. The effective testing or calibration methods for such capacitance due to defects are not easily available in today´s manufacturing. In this paper, a 3-D field solver was used to see the potential ranges of the defective capacitance. The crosstalk AC current through the coupling capacitance, which is referred to as cell coupling capacitor (CCCP) is newly modeled as a current source to build modified SNM (Static Noise Margin). The two metrics, SNM and VDDMIN show that the reliability under the CCCP can be significantly degraded during memory operations. Even with a marginal CCCP, SNM variation is 40mV at a read operation and VDDMIN shift is 110mV at a write operation in a 65nm SRAM cell.
Keywords :
SRAM chips; capacitors; reliability; 3D field solver; SRAM cell reliability degradation; cell coupling capacitor; cell crosstalk; crosstalk AC current; defective capacitance; no trouble found failures; size 65 nm; static noise margin; voltage 110 mV; voltage 40 mV; Capacitance; Capacitors; Couplings; Crosstalk; Integrated circuit modeling; Random access memory; Reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2010 IEEE International
Conference_Location :
Stanford Sierra, CA
ISSN :
1930-8841
Print_ISBN :
978-1-4244-8521-5
Type :
conf
DOI :
10.1109/IIRW.2010.5706505
Filename :
5706505
Link To Document :
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