Properties of directly electroplated copper on CoMo alloy diffusion barrier

The properties of directly electroplated Cu on CoMo alloy diffusion barrier were analyzed by FPP, XRD and SEM. Comparison was made between electroplated Cu on CoMo with and without a seed layer. Also, the self-annealing behaviors of both direct electroplated Cu on CoMo and Cu/CoMo were investigated further. Due to the self-annealing process, the defects of directly electroplated Cu on CoMo are recovered resulting in a less resistance difference value between electrochemical deposited (ECD) Cu on CoMo and ECD Cu on Cu/CoMo.