Title :
A 19DBM 5.8GHzz PA demonstrator with a novel low ron high FT RF LDMOS
Author :
Chaojiang Li ; Zierak, Michael ; Wolf, Robert ; Wang, Dongping ; Boenke, Myra ; Hanyi Ding ; Feilchenfeld, Natalie ; Letavic, Ted
Author_Institution :
IBM Microelectron., Essex Junction, VT, USA
Abstract :
In this paper, we introduce an isolated RF LDMOS NFET is for RF Power Amplifier (PA) and power management applications. The RF LDMOS NFET has demonstrated a drain-source turn-on resistance (Rds,on) of 1.45ohm-mm, a cutoff frequency (Ft) greater than 40GHz and a drain-source breakdown down voltage (BV) in excess of 9V. For PA designs, the isolation layer is floating to reduce the parasitic and achieve high PAE/nonlinearity performance. RF power amplifier cores were fabricated and measured at 2.4GHz and 5.8GHz to demonstrate the RF LDMOS performance in PAs. Under CW loadpull and 3.3V supply, 18dB and 12dB gains (Gt) are achieved at 2.4GHz and 5.8GHz respectively, with 1dB compression point power density at 22dBm/mm gate width, and PAE > 63%, maximum PAE > 70%. Due to good model to hardware Pout correlation in a 5.8GHz PA cell, a fully matched PA last stage with the load-pull fundamental and harmonic impedances showed a less than 4° AM-PM phase distortion, meeting the 802.11n spectral mask requirement with 20MHz 64QAM modulated signal at 19dBm Pout.
Keywords :
MOSFET; microwave power amplifiers; 64QAM modulated signal; 802.11n spectral mask requirement; AM-PM phase distortion; BV; CW loadpull; LDMOS NFET; PA designs; PAE performance; RF power amplifier; breakdown down voltage; drain-source turn-on resistance; frequency 2.4 GHz; frequency 5.8 GHz; gain 12 dB; gain 18 dB; harmonic impedances; isolation layer; load-pull fundamental impedances; nonlinearity performance; power management applications; voltage 3.3 V; CMOS integrated circuits; Correlation; Field effect transistors; Harmonic analysis; IEEE 802.11n Standard; Power amplifiers; Radio frequency; 802.11n; PAE; RF LDMOS; power amplifier;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4799-3296-2
DOI :
10.1109/ICSICT.2014.7021359